Trade fair highlight 18. September 2023

Epoxy Moulding Compound with increased thermal conductivity

For applications with increased heat dissipation requirements, Duresco is pleased to present the product NU 6640 X.

This new product on the market offers the following advantages:
- Increased, isotropic heat dissipation
- Good price/performance ratio
- Optimised cycle time
- Processing under standard conditions

We would be happy to discuss with you whether this or any other of our products are suitable for your applications.
We look forward to welcoming you at our stand hall B4 – booth B4-4306.